Intel will also incorporate glass substrates into future chips. But Corning has quite a bit of skin in the glass substrate game since demand for the material is expected to exceed that of its ...

Why is this important? Because slapping chips on top of a glass substrates rather than organic ones for chiplet-to-chiplet and chip-to-motherboard communication has all kinds of benefits.

The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces ...

Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips. Glass substrate prices ...

This research team recently developed an easy, repeatable technique for printing a periodic nano/microstructure on a glass substrate surface using a PDMS slab. A PDMS slab contains liquid PDMS ...

As chips are disaggregated into chiplets ... This has opened the door to new architectures, new materials such as glass substrates, and a variety of new challenges. Dick Otte, president and CEO of ...

Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a ...

These technologies are used to efficiently connect chips and printed circuit boards (PCBs). As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced ...

glass substrates, chip-on-wafer-on-substrate (CoWoS), and silicon photonics integration. Generative AI applications are rapidly expanding, transitioning from cloud-based services to edge deployments.

Then, they started the coating process by initially dipping pre-cleaned microscope glass slide substrates in a dip coater with SiO2-TiO2, then putting them to dry and in a heat treatment.